IEEE - Institute of Electrical and Electronics Engineers, Inc. - Harnessing Horizontal Parallelism and Vertical Instruction Packing of Programs to Improve System Overall Efficiency

Design, Automation & Test in Europe. DATE'08

Author(s): Hai Lin ; Yunsi Fei
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: Munich, Germany
Conference Date: 10 March 2008
Page(s): 758 - 763
ISBN (CD): 978-3-9810801-4-8
ISBN (Paper): 978-3-9810801-3-1
DOI: 10.1109/DATE.2008.4484770
Regular:

Multi-issue processors can exploit the instruction level parallelism (ILP) of programs to improve the performance greatly. How to reduce the energy consumption while maintaining the high... View More

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