IEEE - Institute of Electrical and Electronics Engineers, Inc. - Temperature Control of High-Performance Multi-core Platforms Using Convex Optimization

Design, Automation & Test in Europe. DATE'08

Author(s): S. Murali ; A. Mutapcic ; D. Atienza ; R. Gupta ; S. Boyd ; L. Benini ; G. De Micheli
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Conference Location: Munich, Germany
Conference Date: 10 March 2008
Page(s): 110 - 115
ISBN (CD): 978-3-9810801-4-8
ISBN (Paper): 978-3-9810801-3-1
DOI: 10.1109/DATE.2008.4484671
Regular:

With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperature. Temperature... View More

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