IEEE - Institute of Electrical and Electronics Engineers, Inc. - Substrate Integrated Circuits (SICs) for low-cost high-density integration of millimeter-wave wireless systems

2008 IEEE Radio and Wireless Symposium (RWS '08)

Author(s): Ke Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2008
Conference Location: Orlando, FL, USA
Conference Date: 22 January 2008
Page(s): 683 - 686
ISBN (CD): 978-1-4244-1463-5
ISBN (Paper): 978-1-4244-1462-8
DOI: 10.1109/RWS.2008.4463584
Regular:

The attractiveness and popularity of substrate integrated circuits (SICs) now become more and more apparent in our microwave and millimeter-wave community with numerous academic publications and... View More

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