IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stress grading in integrated power modules

2007 7th Internatonal Conference on Power Electronics (ICPE)

Author(s): C. Duchesne ; M. Mermet-Guyennet ; E. Dutarde ; T. Lebey ; S. Dagdag
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Daegu, South Korea
Conference Date: 22 October 2007
Page(s): 347 - 351
ISBN (CD): 978-1-4244-1872-5
ISBN (Paper): 978-1-4244-1871-8
ISSN (Electronic): 2150-6086
ISSN (Paper): 2150-6078
DOI: 10.1109/ICPE.2007.4692407
Regular:

Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level.... View More

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