1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.

1.2 This standard sets purity grade levels, analytical meth...

1.1 These test methods cover the determination of relative permittivity, dissipation factor, loss index, power factor, phase angle, and loss angle of specimens of solid electrical insulating materials when the standards used are lumped impedances. The frequency range that can be covered extends f...

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1 The grade designation is a measure of total ...

1.1 This test method describes the determination of plutonium in solutions of unirradiated nuclear-grade (that is, high-purity) materials by controlled-potential coulometry. Controlled-potential coulometry may be performed in a choice of supporting electrolytes, such as 0.9 HNO 3 , 1 H...

1.1 These test methods cover the determination of ammonia nitrogen, exclusive of organic nitrogen, in water. Two test methods are included as follows:

Section Test Method A-Direct Nesslerization ...