IEEE - Institute of Electrical and Electronics Engineers, Inc. - Determination of copper contamination from various sources in an RFIC wafer fab using VPD -TXRF methodology

2007 Asia-Pacific Conference on Applied Electromagnetics (APACE)

Author(s): H.A. Bakar ; Z. Awang ; W. Razali
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Melaka, Malaysia
Conference Date: 4 December 2007
Page(s): 1 - 5
ISBN (CD): 978-1-4244-1435-2
ISBN (Paper): 978-1-4244-1434-5
DOI: 10.1109/APACE.2007.4603944
Regular:

The expansion of radio frequency (RF) applications has given a tremendous push to an increment of circuit density which is can be pack more electronic components on a chip and thereby provide... View More

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