IEEE - Institute of Electrical and Electronics Engineers, Inc. - Exporting solid models (SM) of electrical assemblies into finite element analysis (FEA)

2007 Electrical Insulation Conference and Electrical Manufacturing Expo

Author(s): T. Waggoner
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Nashville, TN, USA
Conference Date: 22 October 2007
Page(s): 374 - 381
ISBN (CD): 978-1-4244-0447-6
ISBN (Paper): 978-1-4244-0446-9
DOI: 10.1109/EEIC.2007.4562646
Regular:

Designing of electrical components and assemblies has changed dramatically from CAD to SM-based designs. Following the SM electrical assembly through the FEA process is different than it was in... View More

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