IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Characterization and Simulation of Packaged Medium Power Amplifier

2007 Asia-Pacific Microwave Conference (APMC '07)

Author(s): S. Chaturvedi ; S.K. Koul ; G.S. Saravanan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Bangkok, Thailand
Conference Date: 11 December 2007
Page(s): 1 - 4
ISBN (CD): 978-1-4244-0749-1
ISBN (Paper): 978-1-4244-0748-4
DOI: 10.1109/APMC.2007.4554947
Regular:

Heat management is a key issue in packaged Microwave active devices and circuits. Estimating the amount of heat generated in the packaged device is important in order to work out a suitable scheme... View More

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