IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesive and mechanical properties of Carbon nanotube filled thermoplastic polyimide films for microelectronics packaging

Third International Conference on Emerging Technologies 2007 (ICET 2007)

Author(s): M.B. Saeed
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Islamabad, Pakistan
Conference Date: 12 November 2007
Page(s): 300 - 305
ISBN (CD): 978-1-4244-1494-9
ISBN (Paper): 978-1-4244-1493-2
DOI: 10.1109/ICET.2007.4516362
Regular:

In this study the mechanical and adhesive properties of Multi-walled carbon nano- tubes (MWNTs) filled polyimide composite films (MWNT-PI) are investigated to determine their usefulness as... View More

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