IEEE - Institute of Electrical and Electronics Engineers, Inc. - Introduction to OKins electronics

2007 9th International Conference on Electronic Materials and Packaging (EMAP '07)

Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Daejeon, South Korea
Conference Date: 19 November 2007
Page(s): 1 - 34
ISBN (CD): 978-1-4244-1910-4
ISBN (Paper): 978-1-4244-1909-8
DOI: 10.1109/EMAP.2007.4510341
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