IEEE - Institute of Electrical and Electronics Engineers, Inc. - Performance and modeling of bonding wire transformers in a package for RF IC's

2007 International Conference on Microelectronics

Author(s): Kuan-Yu Lin ; M.N. El-Gamal
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Cairo, Egypt
Conference Date: 29 December 2007
Page(s): 347 - 350
ISBN (CD): 978-1-4244-1847-3
ISBN (Paper): 978-1-4244-1846-6
DOI: 10.1109/ICM.2007.4497726
Regular:

The experimental investigation of the inductances and coupling factors of bonding wire transformers on packages is presented in this paper. The impact of the length and spacing between the bonding... View More

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