IEEE - Institute of Electrical and Electronics Engineers, Inc. - Power supply noise investigation of a multilayered IC package: full wave simulation and model validation

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): A.C. Scogna ; C. Ritota
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 237 - 240
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512260
Regular:

The present paper investigates the power supply noise in multilayered IC packages and analyzes the effect of shorting vias. A full wave code, based on the Finite Integration Technique (FIT), is... View More

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