IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interconnection effects in Package on Package design

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): P. Pulici ; G. Candela ; G. Campardo ; G.P. Vanalli ; P.P. Stoppino ; A. Losavio ; T. Lessio ; M. Dellutri ; D. Guarnaccia ; F. Lo Iacono
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 163 - 166
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512239
Regular:

The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP structure is more and more diffused... View More

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