IEEE - Institute of Electrical and Electronics Engineers, Inc. - A simple filtering approach to improve the return loss of a PCB to DIE transition trough a PBGA package for over GHz applications

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): J.R. Cubillo ; J. Gaubert ; S. Bourdel ; H. Barthelemy ; P. Pannier
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 159 - 162
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512238
Regular:

We present in this paper, based on HFSS simulation studies, a simple way to improve a PCB to DIE transition (trough a Plastic Ball Grid Array (PBGA) package) for a 50 Ohm impedance of reference.... View More

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