IEEE - Institute of Electrical and Electronics Engineers, Inc. - Signal propagation over perforated reference planes

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): Lei Shan ; M. Ritter ; A. Haridass ; R. Weekly ; D. Becker ; E. Klink
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 103 - 106
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512222
Regular:

Voids on reference planes are commonly seen in organic chip packages and printed circuit boards. In this paper, the effects of these voids on the signal integrity of a high-density data bus will... View More

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