IEEE - Institute of Electrical and Electronics Engineers, Inc. - Determination of transmission line parameters in time- and frequency domain for product related packaging structures

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): T.-M. Winkel ; A. Deutsch ; G.A. Katopis ; G.V. Kopcsay ; W.D. Dyckman ; B. Chamberlin ; C.W. Surovic ; H. Liu ; C. Baks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 99 - 102
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512221
Regular:

Special test vehicles have been built for first and low loss second level packages including product related test line structures. The characteristic transmission line parameters were measured in... View More

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