IEEE - Institute of Electrical and Electronics Engineers, Inc. - Frequency domain analysis of transmission zeroes on high-speed interconnects in the presence of an orthogonal metal grid underlayer

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): Y. Quere ; T. Le Gouguec ; P.-M. Martin ; D. Le Berre ; F. Huret
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 95 - 98
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512220
Regular:

This paper addresses high-speed interconnects in high density systems (systems on chip (SoC) in package (SiP) ...). These lines (of microstrip or coplanar type) often have an underlayer of... View More

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