IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison Between Metallic Carbon Nanotube and Copper Future VLSI Nano-interconnects

11th IEEE Workshop on Signal Propagation on Interconnects

Author(s): A. Maffucci ; G. Miano ; F. Villone
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Genova, Italy
Conference Date: 13 May 2007
Page(s): 29 - 32
ISBN (CD): 978-1-4244-1224-2
ISBN (Paper): 978-1-4244-1223-5
DOI: 10.1109/SPI.2007.4512200
Regular:

This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of... View More

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