IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling capacitive links for broadband inter-chip communication

2007 NORCHIP Conference

Author(s): O. Viitala ; J. Flak ; S. Lindfors
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Aalborg, Denmark
Conference Date: 19 November 2007
Page(s): 1 - 4
ISBN (CD): 978-1-4244-1517-5
ISBN (Paper): 978-1-4244-1516-8
DOI: 10.1109/NORCHP.2007.4481058
Regular:

This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top... View More

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