IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Boundary Conditions on the Dynamic Response Characterization Of Board-Level Drop Test

2007 9th Electronics Packaging Technolgy Conference

Author(s): Seungbae Park ; C. Shah ; Jae Kwak
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Singapore, Singapore
Conference Date: 10 December 2007
Page(s): 374 - 379
ISBN (CD): 978-1-4244-1323-2
ISBN (Paper): 978-1-4244-1324-9
DOI: 10.1109/EPTC.2007.4469810
Regular:

Board-level drop test has emerged as a key qualification test for assessing the impact reliability of electronic components. JEDEC standards for board level drop test address different test board... View More

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