IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels
2007 9th Electronics Packaging Technolgy Conference
| Author(s): | D. Stephan ; Y.H. Chew ; H.M. Goh ; E. Pasamanero ; E.P.P. Theint ; D.R.M. Calpito ; J. Ling |
| Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
| Publication Date: | 1 December 2007 |
| Conference Location: | Singapore, Singapore |
| Conference Date: | 10 December 2007 |
| Page(s): | 737 - 742 |
| ISBN (CD): | 978-1-4244-1323-2 |
| ISBN (Paper): | 978-1-4244-1324-9 |
| DOI: | 10.1109/EPTC.2007.4469780 |
Regular:
Over 90% of all interconnection methods in the semiconductor industry are using gold bonding wire. As the industry migrates into smaller unit size for electronic products, thinner wires are... View More
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