IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels

2007 9th Electronics Packaging Technolgy Conference

Author(s): D. Stephan ; Y.H. Chew ; H.M. Goh ; E. Pasamanero ; E.P.P. Theint ; D.R.M. Calpito ; J. Ling
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Singapore, Singapore
Conference Date: 10 December 2007
Page(s): 737 - 742
ISBN (CD): 978-1-4244-1323-2
ISBN (Paper): 978-1-4244-1324-9
DOI: 10.1109/EPTC.2007.4469780
Regular:

Over 90% of all interconnection methods in the semiconductor industry are using gold bonding wire. As the industry migrates into smaller unit size for electronic products, thinner wires are... View More

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