IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulated and Experimental Thermal Analysis of Home Entertainment Server

2007 9th Electronics Packaging Technolgy Conference

Author(s): Chong Nyok Boon ; Law Sie Yong ; Foong Foo Kong ; Kim Han Jong ; Ong Eng Hong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Singapore, Singapore
Conference Date: 10 December 2007
Page(s): 888 - 891
ISBN (CD): 978-1-4244-1323-2
ISBN (Paper): 978-1-4244-1324-9
DOI: 10.1109/EPTC.2007.4469732
Regular:

This paper describes the simulated and experimental thermal analysis of a home entertainment server (home server). Heat dissipation per unit area in consumer electronics is set to increase... View More

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