IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ascertaining of Copper Contamination from Various Sources in the Wafer Fab by Using VPD-TXRF Methodology

Student Conference on Research and Development - SCOReD 2007

Author(s): H. Abu Bakar ; Z. Awang ; W.A.A. Wan Razali
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2007
Conference Location: Selangor, Malaysia, Malaysia
Conference Date: 12 December 2007
Page(s): 1 - 5
ISBN (CD): 978-1-4244-1470-3
ISBN (Paper): 978-1-4244-1469-7
DOI: 10.1109/SCORED.2007.4451384
Regular:

Preventing and monitoring of Cu cross contamination become critical for the semiconductor industries since most of them are converting to mass-producing chips with copper (Cu), rather than... View More

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