IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of deteriorated anti-stiction layer in NIL

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): J. Ishihara ; A. Koszewski ; M. Kayama ; H. Kawata ; Z. Rymuza ; Y. Hirai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 450 - 451
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456298
Regular:

Mold releasing is one of the important issues in nanoimprint lithography (NIL). In this paper, de-molding force and friction coefficients for deteriorated surface statuses are quantitatively... View More

Advertisement