IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Examination of Shrink Processes and Double Patterning for Achieving 32 and 22 nm Technologies in Contact/Via Holes

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): E. Nishimura ; M. Kushibiki ; T. Kawasaki ; S. Shimura ; F. Iwao ; M. Carcasi ; S. Scheer ; H. Yaegashi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 396 - 397
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456271
Regular:

This paper investigates novel shrink processes and double patterning techniques as a means to enhancing resolution of water based optical immersion lithography. This paper also demonstrates single... View More

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