IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of Stainless Steel Mold using Electro Chemical Fabrication (ECF) method for Microfluidic Biochip

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): Min-Soo Cho ; Hyun-Woo Lim ; C.S. Lee ; Byung-Ki Cho ; Young-sik Cho ; Jin-Goo Park
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 334 - 335
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456240
Regular:

In this paper, SUS mold was fabricated using both ECF method and FeCl3 wet etching. The ECF mold showed the surface roughness values much better than that for FeCl3 etched... View More

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