IEEE - Institute of Electrical and Electronics Engineers, Inc. - High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): Chun-Chang Wu ; S.L.-C. Hsu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 312 - 313
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456229
Regular:

EPON828 epoxy resin crosslinked by a curing agent 954 is compatible for thermocurable nanoimprint lithography and can be used in the PET/ITO plastic substrate. The relationships between curing... View More

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