IEEE - Institute of Electrical and Electronics Engineers, Inc. - Imprinted 50 nm features by UV step and stamp imprint lithography method

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): T. Haatainen ; P. Majander ; T. Makela ; J. Ahopelto
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 280 - 281
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456213
Regular:

In this paper, we report on fabrication of 50 nm features by using a UV step and stamp imprint lithography method (UV SSIL), which is based on thermal SSIL using a flip chip bonder. The idea is to... View More

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