IEEE - Institute of Electrical and Electronics Engineers, Inc. - Damage Free Particle Removal from EUVL Mask Layers by High Energy Laser Shock Cleaning (LSC)

Microprocesses and Nanotechnology 2007. 20th International Microprocesses and Nanotechnology Conference

Author(s): Tae-Gon Kim ; Young-Sam Yoo ; Il-Ryong Son ; Tae-Geun Kim ; Jinho Ahn ; Jong-Myoung Lee ; Jae-Sung Choi ; A.A. Busnaina ; Jin-Goo Park
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2007
Conference Location: Kyoto, Japan
Conference Date: 5 November 2007
Page(s): 48 - 49
ISBN (Paper): 978-4-9902472-4-9
DOI: 10.1109/IMNC.2007.4456098
Regular:

The paper deals about the method of small particle removal based on laser induced plasma (LIP) shock wave has been recently applied to clean wafers and masks in semiconductor processes. The silica... View More

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