IEEE - Institute of Electrical and Electronics Engineers, Inc. - Inverse damage detection in IC packaging component

13th International Workshop on Thermal Investigation of ICs and Systems

Author(s): Chun-Yin Wu ; Wen-Chang Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2007
Conference Location: Budapest, Hungary
Conference Date: 17 September 2007
Page(s): 214
ISBN (Paper): 978-2-35500-002-7
DOI: 10.1109/THERMINIC.2007.4451780
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