IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging and Microelectromechanical Systems (MEMS)

2007 8th International Conference on Electronic Packaging Technology - ICEPT '07

Author(s): Y.C. Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2007
Conference Location: Shanghai, China
Conference Date: 14 August 2007
Page(s): 1 - 5
ISBN (CD): 978-1-4244-1392-8
ISBN (Paper): 978-1-4244-1391-1
DOI: 10.1109/ICEPT.2007.4441562
Regular:

Packaging is critical to the advancement of microsystems integrating microelectromechanical systems (MEMS) with microelectronic, optoelectronic and microwave devices. This paper discusses... View More

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