IEEE - Institute of Electrical and Electronics Engineers, Inc. - Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions

2007 8th International Conference on Electronic Packaging Technology - ICEPT '07

Author(s): J.J.M. Zaal ; W.D. van Driel ; H.P. Hochstenbach ; G.Q. Zhang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2007
Conference Location: Shanghai, China
Conference Date: 14 August 2007
Page(s): 1 - 6
ISBN (CD): 978-1-4244-1392-8
ISBN (Paper): 978-1-4244-1391-1
DOI: 10.1109/ICEPT.2007.4441528
Regular:

A common failure during the lifetime of most mobile devices is failure through dropping. This is nowadays tested by means of the drop impact test, which has been standardized by JEDEC. This method... View More

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