IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Vacuum Package on the Stiction Force of Micro-structure

2007 8th International Conference on Electronic Packaging Technology - ICEPT '07

Author(s): Junwen Liu ; Jing Song ; Qingan Huang ; Jieying Tang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2007
Conference Location: Shanghai, China
Conference Date: 14 August 2007
Page(s): 1 - 6
ISBN (CD): 978-1-4244-1392-8
ISBN (Paper): 978-1-4244-1391-1
DOI: 10.1109/ICEPT.2007.4441527
Regular:

Vacuum packaging is introduced as a main mode for the MEMS (micro-electronics-mechanical-system) devices packaging. The reliability of devices in a vacuum package has become the most... View More

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