IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fracture Simulation of Solder Joints by a Lattice Model

2007 8th International Conference on Electronic Packaging Technology - ICEPT '07

Author(s): Tong An ; Fei Qin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2007
Conference Location: Shanghai, China
Conference Date: 14 August 2007
Page(s): 1 - 4
ISBN (CD): 978-1-4244-1392-8
ISBN (Paper): 978-1-4244-1391-1
DOI: 10.1109/ICEPT.2007.4441406
Regular:

Solder joints serve as mechanical, thermal and electrical interconnections between the electronic packages and the printed circuit board (PCB). Fracture of the solder joint is the most common... View More

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