IEEE - Institute of Electrical and Electronics Engineers, Inc. - Backside E-Beam Probing on Nano scale devices

International Test Conference 2007

Author(s): R. Schlangen ; R. Leihkauf ; U. Kerst ; C. Boit ; R. Jain ; T. Malik ; K. Wilsher ; T. Lundquist ; B. Kruger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Santa Clara, CA, USA
Conference Date: 21 October 2007
Page(s): 1 - 9
ISBN (CD): 978-1-4244-1128-3
ISBN (Paper): 978-1-4244-1127-6
ISSN (Paper): 1089-3539
DOI: 10.1109/TEST.2007.4437627
Regular:

IC debug with E-beam probing is presented in an innovative application accessing the active device directly from chip backside after FIB preparation. The potential of this approach in nanoscale... View More

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