IEEE - Institute of Electrical and Electronics Engineers, Inc. - Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu

2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference

Author(s): S.C. Yang ; C.R. Kao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Taipei, Taiwan
Conference Date: 1 October 2007
Page(s): 102 - 105
ISBN (CD): 978-1-4244-1637-0
ISBN (Paper): 978-1-4244-1636-3
DOI: 10.1109/IMPACT.2007.4433577
Regular:

Sn-Ag-Cu alloys are considered to be the most promising lead-free alloy systems in packaging industry. However, it required the addition of minor alloy elements to improve the properties of the... View More

Advertisement