IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of skin incision closure using diode laser and ICG -albumin protein solder

2007 Quantum Electronics and Laser Science Conference

Author(s): M.E. Khosroshahi ; M.S. Nourbakhsh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2007
Conference Location: Baltimore, MD, USA, USA
Conference Date: 6 May 2007
Page(s): 1 - 2
ISBN (CD): 978-1-55752-834-6
DOI: 10.1109/QELS.2007.4431284
Regular:

The optical and thermal parameters are optimized for an invitro skin closure using a 10W diode laser at 800 nm. The major results showed the effects of static and dynamic modes of treatments on... View More

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