Very Long Instruction Word (VLIW) architectures are commonly used in application-specific domains due to their parallelism and low-power characteristics. Recently, parameterization of such architectures allows for runtime adaptation of the issue-width to match the inherent Instruction Level Parallel...

Chip-on-Film (CoF) is a packaging technology that mounts Integrated Circuits (IC) chips directly on a flexible substrate surface. As both power and the number of pins in such packages increase, thermal conditions become more important. In this paper, the thermal resistance of CoF packages is studied...

The aqueous solutions are evaluated as sustainable reactive extraction solvents for the recovery of monohydroxyl alcohols (benzyl alcohol, 1-hexanol, cyclohexanol) present in few-percent concentrations in apolar hydrocarbons (toluene, n-hexane, and cyclohexane) by considering two approaches. An aque...

The layout of power modules is one of the key points in power module design, especially for silicon carbide module, which may parallel more devices compared with silicon counterpart. In this paper, along with the design example, a improved layout design method for planar power modules is presented. ...

Structure Data Layout Optimization (SDLO) is a prevailing compiler optimization technique to improve cache efficiency. Structure transformation is a critical step for SDLO. Diversity of transformation methods and existence of complex data types are major challenges for structure transformation. We h...