IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ceramic Package Solutions for MEMS Sensors

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): A. Schubring ; Y. Fujita
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 268 - 272
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417075
Regular:

Implementation of microelectroMechanical systems (MEMS) sensors continues to increase as MEMS technology gains acceptance as a reliable and cost competitive design solution. Ceramic... View More

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