IEEE - Institute of Electrical and Electronics Engineers, Inc. - The Method of Making Low-cost Multiple-Row QFN

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): M.J. Ramos ; R.S. Antonio ; L. Guirit ; A. Subagio ; H. Handoyo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 261 - 267
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417074
Regular:

QFN demand has dramatically increased during the past 3 years. It has been replacing older packages like SOIC and TSSOP mainly because of the added thermal enhancements from the exposed pad, as... View More

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