IEEE - Institute of Electrical and Electronics Engineers, Inc. - Treated Lead-frame for Leaded Plastic Molded Package

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): S. Krishnan ; Y.S. Won ; K.Y. Lau
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 256 - 260
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417073
Regular:

Interfacial adhesion thru surface roughening technique has become the focus subject in this new packaging era. Though it is a widely used technology in leadless packages, there are no works... View More

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