IEEE - Institute of Electrical and Electronics Engineers, Inc. - Pb-free BGA Solder Joint Reliability Improvement with Sn3.5Ag Solder Alloy on Ni/Au Finish

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): Eu Poh Leng ; Min Ding ; W. Lindsay ; S. Chopin ; I. Ahmad ; A. Jalar
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 243 - 250
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417071
Regular:

In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8AgO.7Cu solder balls on Ball Grid Array (BGA) packages... View More

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