IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): S. Mallik ; N.N. Ekere ; R. Durairaj ; A.E. Marks
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 165 - 171
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417065
Regular:

The market for solder paste materials in the electronics sector is very large and consists of material and equipment suppliers and end users. These materials are used to bond electronic components... View More

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