IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hygro-thermal Finite Element Analysis of Green Stacked Die Package

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): Z.K. Hua ; C.Y. Li ; J.H. Zhang ; Y.X. Luo ; L.Q. Cao
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 86 - 91
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417057
Regular:

3D stacked die packages are especially common today. With thinner chip and multi-layer, it requires higher reliability of such a package design. Besides this, with the increasing rigid... View More

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