IEEE - Institute of Electrical and Electronics Engineers, Inc. - 3D Electrical Interconnection Using Extrusion Dispensed Conductive Adhesives

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): L.D. Andrews ; T.C. Caskey ; S.J.S. McElrea
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 76 - 80
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417055
Regular:

Electrical interconnections may be formed along the edges of stacked integrated circuits by an extrusion process that utilizes automated needle dispense equipment to form local deposits of... View More

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