IEEE - Institute of Electrical and Electronics Engineers, Inc. - Dicing Die Attach Film for 3D Stacked Die QFN Packages

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): S. Abdullah ; S. Mohd Yusof ; I. Ahmad ; A. Jalar ; R. Daud
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 73 - 75
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417054
Regular:

The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm,... View More

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