IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Product Design and Materials on Large Leadless Package Reliability

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): J. Kumar ; Won Yuri Sung ; S. Krishnan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 53 - 57
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417053
Regular:

With the market acceptance of small sized leaded packages migration to quad flat no lead version (QFN), an increasing number of large size semiconductor devices are being transferred into leadless... View More

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