IEEE - Institute of Electrical and Electronics Engineers, Inc. - Overmolded FC-SiP for Miniaturized Devices

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): Erik Jung ; M. Koch ; K.-F. Becker ; V. Bader ; R. Aschenbrenner ; H. Reichl
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 24 - 27
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417050
Regular:

The degree of integration of modern circuits has gone from singledie towards multi-die or even system partition integration. System-In-Package concepts allow to integrate in a hybrid form circuit... View More

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