IEEE - Institute of Electrical and Electronics Engineers, Inc. - Three Dimensional Flow Analysis During Injection Molding Process For Stacked-Die Packages

2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium

Author(s): Sung-won Moon ; Cheng Yang ; Zhihua Li ; A. Fischer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: San Jose, CA, USA
Conference Date: 3 October 2007
Page(s): 20 - 23
ISBN (CD): 978-1-4244-1336-2
ISBN (Paper): 978-1-4244-1335-5
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.2007.4417049
Regular:

The three-dimensional numerical simulation has been performed to study mold flow characteristics during injection molding process of stacked die packages. The modeling results revealed that flow... View More

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