IEEE - Institute of Electrical and Electronics Engineers, Inc. - Third type interconnection architecture for the 3D MP-SoC design

2007 7th International Conference on ASIC Proceeding

Author(s): Zeng Fantai ; A. Ivanov ; C. Grecu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2007
Conference Location: Guilin, China
Conference Date: 22 October 2007
Page(s): 902 - 905
ISBN (CD): 978-1-4244-1132-0
ISBN (Paper): 978-1-4244-1131-3
DOI: 10.1109/ICASIC.2007.4415777
Regular:

This paper presents a method of design for three dimensional multi-processor system on chip (3D MP-SoC); specifically, we recommend a three dimension direct access multi-port memory (3D DA-MPM)... View More

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